Once the CPU is placed in the socket holder the other plate with the slider bar is placed on top of it. Precision is of utmost importance here otherwise the risk of damaging the chip would be higher. The quality and the precision of the two plates is top notch. Screw rotation will slide in or out the slider bar. There is an aluminum slider bar which is hooked up with a long screw. While the second plate has the grooved section which faces the CPU Socket area. One plate has the socket holder for the CPU itself. The delid kit consists of two plates which are Precision CNC machined. RockIt Cool is offering CoolLaboratory Liquid Ultra $13 and the Loctite Super Glue $5. This does not include the TIM and the Glue. Price: $30 for Black color Delid tool and $8 for the Re-Lid kit. This review will include the thermal performance of the chip before and after delid. They sent me the complete kit for the Intel 7700k (LGA-1151). Today, I will be looking at Rockit 88 Delid kit and Re-Lid kit for 1150/1151 sockets from the RockIT Cool. These are handy tools and allow the users to safely delid/relid their chips without damaging them most of the times. In recent times, many enthusiasts have introduced kits or tools to delid/relid the CPUs. Delidding would instantly void the warranty of the chip. While it sounds fun but it involves a higher risk of damaging the chip. Various methods have been in used to delid the IHS. This calls for better and more efficient thermal conductance. This is because the stock adhesive used on the Intel chips creates distance between the IHS and the CPU die which is reduced in delidding/relidding. When IHS is relided or placed on top of the CPU die after the delidding, it makes a better point of contact with the CPU die. Either IHS can be relidded using glue or is simply placed on the CPU die without any glue. Basic idea is to remove the IHS, change the stock TIM with a better one, preferably liquid metal. Hence, the term Delid refers to removing the IHS. Here lid refers to the IHS of the CPU and De means to remove. Use of crappy TIM can hinder the thermal performance.Įnthusiasts come up with the solution termed as “Delidding” from “Delid”. Using this method, IHS is glued to the CPU die and the TIM (Thermal Interface Material) makes point of contact between the CPU chip and the IHS. With the Ivy Bridge microarchitecture, Intel started to use Thermal Paste method for heat transfer between the CPU chip and the IHS. This method ensures the efficient heat transfer from the CPU die to the IHS. Before the Ivy Bridge, Intel was soldering the IHS on the CPU die itself. With the introduction of the Ivy Bridge chips from the Intel, many users reported the chips to be running hot with temps spiking.
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